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| Monthly Capacity : |
6000 Sq.m. for Multilayers |
| Layer Counts: |
1-40 Layers |
| Products Type: |
HF(High Frequency) & RF(Radio Frequency)board, Impedance controlled board, HDI board, BGA & Fine Pitch board, Thicker Copper |
| Board Material: |
| Base Material: |
FR4( Sheng Yi, KB, ITEQ) |
| Aluminum Based: |
Bergquist(USA), CSEM(TW) |
| HF&RF Products: |
Rogers, Taconic, Arlon, Nelco |
| High TG Products: |
Shengyi （S1170），Isola，IT180
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| Solder Mask: |
Taiyo |
| Finished Surface: |
HASL, Lead free HASL,
Immersion Gold, Immersion Silver, Immersion Tin,
Hard Gold, OSP,
Peelable Soldermask , Carbon Ink |
| Technical Specification |
| IPC: |
Class 3 |
| Aspect ratio: |
10:1 |
| Max production size: |
600X800mm |
| Minimum line width/gap: |
3.0/3.0mil |
| Minimum hole size: |
0.15mm(mechanical drill)/4mil(laser drill) |
| Minimum Annular Ring: |
4mil |
| Max Copper thickness: |
10OZ |
| Board Thickness: |
Double Sides 0.2-7.0mm, Multilayers:0.40-7.0mm |
| Min Solder Mask Bridge: |
≥0.08mm |
| Plugging Vias Capability: |
0.2-0.8mm |
| Special Technique: |
Blind/Buried Via hole
Semi-plating holes
Countersink Hole
Via in Pad
Blind slot
Press fit technology
Edge-plating
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| Tolerance |
| Plated holes Tolerance: |
±0.08mm(min±0.05) |
| Non-plated hole tolerance: |
±0.05mm(min+0/-0.05mm or+0.05/-0mm) |
| Outline Tolerance: |
±0.15mm(min±0.10mm) |
| Functional test |
| Insulating resistance: |
50 ohms( normality) |
| Peel off strength: |
1.4N/mm |
| Thermal Stress test: |
260 degree,20 seconds |
| Solder mask hardness: |
10V-250V |
| Warp and Twist: |
≤0.7% |
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